The element employs a bifilar wound wire grid on an insulating substrate . 元件系用双股绕线网缠绕在一块绝缘基板上。
2.
A way to circumvent the problem is to fabricate devices in small islands of silicon on an insulating substrate as shown in fig. 32 . 消除这个问题的一个方法是把器件制造在绝缘衬底的硅岛上，如图32所示。
3.
Bga transform and insulating substrate technology 焊球阵列转变与绝缘基板技术
4.
Microelectronic circuits in which the passive components and their metallic interconnections are formed directly on an insulating substrate and the active semiconductor devices ( usually in wafer form ) are added subsequently 一种微电子电路器件，其中的无源元件及内部金属连线直接在绝缘衬底上形成，然后再加上有源半导体器件（通常以大圆片形式给出） 。
